DIE ATTACH

DIE ATTACH

DIE ATTACH OP9 M Di solder paste

Major advantages of the MBO DIE ATTACH solder paste:

  • Very good behaviour in dispensing
  • No clean and halogen free formulated
  • Extra clear and colourless residues
  • Low voiding for long term reliability solder joint

Organic No Clean OP9 M Di solder paste has been developed in the MBO laboratories. It is specially designed to offer a high level of activity while leaving very low residues, very clear and non-corrosive. This product, suitable for dispensing, meets the international requirements of the electronics industry.

  • ORL0 classification according to J-STD-004
  • Halide free.
  • REACH compliant
  • High activity.
  • Very low residues, neutral and colorless.

Organic No Clean OP9 M Di solder paste is manufactured in strict compliance with current international standards.

Available alloys

Technical data

Dispensing
OP9 M Di solder paste is suitable for all dispensing machines equipped with needles up to 0.41 mm in diameter (class 5 metal powder).

Packaging:
5 cc, 10 cc, 30 cc syringes. Other on request.

Ambient conditions 
18-22°C and 35% to 70% RH. 

Cleaning of tools:
Most standard cleaning products. Also possible with hot water.

Storage:
In original packaging, between 5 and 10 ° C, for up to 6 months. Wait until the syringes are at room temperature before use to avoid condensation on the paste. Storage at room temperature : 7 days maximum.

Additional information: 
Our  manufacturing  processes  have  been  subjected  to  FMECA  analysis  (equivalent  of  AMDEC  in France).

OP9 M Di solder paste is suitable for all dispensing machines equipped with needles up to 0.41 mm in diameter (class 5 metal powder).

Packaging:
5 cc, 10 cc, 30 cc syringes. Other on request.

Ambient conditions 
18-22°C and 35% to 70% RH. 

Cleaning of tools:
Most standard cleaning products. Also possible with hot water.

Storage:
In original packaging, between 5 and 10 ° C, for up to 6 months. Wait until the syringes are at room temperature before use to avoid condensation on the paste. Storage at room temperature : 7 days maximum.

Additional information: 
Our  manufacturing  processes  have  been  subjected  to  FMECA  analysis  (equivalent  of  AMDEC  in France). Colonne 2

Reflow

Heating Methods 
Convection, infrared, vapour phase, hot plate, hot bar, laser and others. Aerobic or inerted. 

Heating Profile 
See suggested reflow profile.

Cleaning solvents 
Most cleaners. Also hot water can be used.
Temperature : 35-60°C. 

DIE ATTACH solid wires

Major advantages of the MBO Preform solid wires :

  • High purity and free of oxides
  • Free of organic contamination on solid wire surface (elaborated extrusion process constantly improving by MBO engineers)
  • Wide range of available diameters (from 18 mils to 40 mils). Others diameters possible on request.
  • Low voiding solid wire (< 5 %).
  • Fully compatible with automatic wire dispensing machine.

General characteristics :
The reliability of electronic components is crucial. Thermal and mechanical fatigue are key parameters in the occurrence of defects.performances thermiques. A perfect joint is very important to get the best thermal performance. Good wetting as well as low void rates help to create a solder connection with highest reliability. MBO provide solid soft solder wires that are flux free and especially optimized for high performance components and die attach applications. They are manufactured by a controlled process in order to ensure the optimal quality.

Physical characteristics :

Packaging / storage:
Solid wire: On special reels dedicated to die attach application
Diameter in mils (18 to 40) in various lengths.
Storage: In original packaging at room temperature for 12 months.

Safety:
Material Safety Data Sheet available on request. Please consult it before use

Additional information:
Quality Certificate available on request.