SOLDER PASTE DISPENSING / JETPRINTING PROCESS
MBO offers its customers a wide range of soldering pastes for both manual and automatic dispensing applications. MBO also develops soldering pastes for specific applications such as jetting and jetprinting. These soldering pastes have been approved by all the major manufacturers of dispensing machines and heads, including MYCRONIC, VERMES, MUSASHI, etc.
| No Clean | Water-Soluble |
|---|---|
| Lead-Free | Lead | Water Cleanable Residues |
|---|---|---|
|
ROL0 |
ROL0 |
ORL0 |
|
SP 300 Di RSN 70 LF Di SIRIUS 1 LF Di ORION 410 Di 410 721 ORION 414 LF JP |
RSN 70 Di SIRIUS 1 Di ORION 410 Di 410 721 ORION 414 JP |
CASCADE 1 |
Activated version (RA) on request with ROL1 classification, SIRIUS 1 MD dedicated to high-temperature alloy (ROL1 classification).
JP version dedicated to Jet Printing in class 6.
Jet Printing application : Type 6 in SAC 305 (Sn96.5Ag3Cu0.5) and Type 5 for low temperature and lead alloys.
| Melting Point (°C) | |
|---|---|
| Alloy | Solid | Liquid |
|---|---|---|
|
Sn95.5Ag3.8Cu0.7 (SAC 387) |
217 |
Eutectic |
|
Sn96.5Ag3Cu0.5 (SAC 305) |
217 |
220 |
|
Sn95Sb5 |
235 |
240 |
|
Sn96.5Ag3.5 |
221 |
Eutectic |
|
Sn99Ag0.3Cu0.7 / Sn98.5Ag0.8Cu0.7 |
217 |
227 / 224 |
|
Sn97Cu3 |
227 |
310 |
|
Sn99CuSP |
227 |
Eutectic |
|
SIA® |
139 |
189 |
|
Sn43Bi57 |
139 |
Eutectic |
|
Sn42Bi57.6Ag0.4 / Sn42Bi57Ag1 |
139 |
Eutectic |
|
Sn63Pb37 |
183 |
Eutectic |
|
Sn62Pb36Ag2 |
179 |
Eutectic |
|
Pb92.5Sn5Ag2.5 |
296 |
301 |
|
Sn18Pb32Bi50 |
98 |
Eutectic |
|
Other on request |
||
- Low-residue no-clean pastes
- Manual or automatic dispensing
- Reflow under air or nitrogen
- Different possible activations
Perfectly spherical, oxide-free powders.
Controlled particle size, ranging from class 3 (25-45 µm) to class 6 (5-15 µm).
Packaging :
- 10 g to 100 g syringes
- 500 g, 1 Kg cartridges
OUR NEWS
ISO 9001
IATF 16949
ISO 9453
ISO 9454