Solder paste dispensing / Jet printing process

Solder paste dispensing / Jet printing process

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Solder paste dispensing / Jet printing process

Activated version (RA) available upon request (ROL1 classification). SIRIUS 1 MD dedicated for high temperature.

JP version dedicated to Jet printing process in type 6 (5-15µm).

Jet printing process : Type 6 in SAC 305 (Sn96.5Ag3Cu0.5) and Type 5 in low melting temperature alloys and in Tin Lead.

  • No clean solder paste with low clear residues
  • Manual or automatic dispensing
  • Can be reflowed in air or under nitrogen 
  • Different activated versions are available

MBO is offering different powder sizes from type 3 (25-45 µm) to type 6 ( 5-15µm).

Packaging :

  • from 10g to 100g syringe
  • 500g, 750g and 1kg cartridge

More about solder pastes