Wave soldering / Selective soldering

Wave soldering / Selective soldering

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MBO Alloys

  • Manufactured by selecting highest purity base metals and by using virgin materials.
  • Produced in a rigorously controlled process to ensure the lowest oxide level.
  • Alloy composition checked by ICP- AES and compliant to ISO 9453 and J-STD 006.

For the current alloys, go to solder wires section to find the requested alloy in the table.

Alloy forms:

  • Bars,
  • Ingots,
  • Sticks,
  • Solid wires,
  • Pellets,
  • Domes

Lead free Alloys

  • Different alloys are available (SAC305, SAC387, SAC0307, Sn99Cu, Sn97Cu3, Sn95Sb5)
  • Lead free alloy without any silver content : Sn99CuSP PLUS “high performances”.

New alloy named SIA® :
This lead free alloy offers the same operating temperatures as Sn60Pb40 and Sn63Pb37 with the same advantages (very good wettability, excellent mechanical properties…). The characteristics of the soldered joints are better than those of the lead-free alloys SnCu and SnAgCu.
Feel free to contact us for more information on this new product (which is available for wave applications and in soldering paste).


The purpose of the flux is to facilitate the soldering process. One of the obstacles to a successful welding joint is an impurity at the interface of the solder, for example, dirt or oxidation. The impurities can be removed by mechanical or chemical cleaning, but the high temperatures required to melt the filler metal (solder) can cause a re-oxidation phenomenon. This effect is accelerated by the increase of the brazing temperature and may in certain cases prevent the welding from being carried out. Some fluxes prevent oxidation and also provide some form of chemical cleaning (against corrosion).

For many years and still today, the most common type of flux used in electronics (soft brazing) was rosin, natural resin from selected pines. This resin is ideal because it is non-corrosive and non-conductive at normal temperatures (25 °C to 65 °C) but becomes slightly reactive (corrosion) at high welding temperatures. Plumbing and automotive applications, among others, generally use a strong acid-based flux (eg, hydrochloric acid) for cleaning the workpiece to be welded.
These fluxes cannot be used in electronic devices because they are conductive and because they eventually dissolve small diameter wires. In this case, it is necessary to clean the welding residues. Many fluxes also act as a wetting agent in the welding process by reducing the surface tension of the molten filler metal and thus allowing it to better distribute on the parts to be soldered.
Thinners are used with MBO flux to stabilize the alcohol based flux density (D40S, D305, FD80).

WATER-RISE 2 : This water based flux is intended for wave soldering applications. Because of its composition, this flux is not flammable and therefore easily transportable. The ORL0 classification of the flux ensures the absence of corrosion over time. This flux is suitable for all lead and lead-free alloys but is particularly recommended for use with the SIA®.

In the case of soft soldering, the fluxes are classified into 3 main families:

Water-soluble fluxes:
These fluxes have a high activity and require cleaning of the residues (with water) after soldering/welding to avoid any phenomenon of corrosion over time.

No Clean fluxes:
These fluxes are « soft enough » not to « require » the removal of their residues due to their non-conductive and non-corrosive nature. These fluxes are called « NO CLEAN » because the residues left after the welding operation is non-conductive and will not cause an electrical short circuit. Nevertheless, they leave a residue going from white to dark brown (depending on the soldering temperature) clearly visible.

The rosin-based fluxes:
Typical rosin-based fluxes are available in a non-activated version (R = Rosin), slightly activated (RMA = Rosin Mildly Activated), RA = Rosin Activated. The RA and RMA formulations contain rosin combined with an activating agent, typically an acid, which increases wettability to the metals to which it is applied by removing existing oxides. The flux is formulated to give a residue that is generally non-corrosive, resulting in optional cleaning of these residues.
The performance of a flux must be carefully evaluated: a very « soft » NO CLEAN flux can be perfectly suited for automatic production equipment but does not give satisfactory results for a badly controlled manual soldering/welding operation.

Complementary products

Desoxidising tablets (DESOXY SP and DESOXY SP PLUS) are available to reduce the surface oxydation of the solder bath (Contact MBO team to select the right part compatible with your solder bath)

Solution to protect surface from solder : Peelable mask
Used to temporarily protect areas of the PCB or components from the adhesion of solder. 
Formulated with natural latex

  • MSP75
  • MSP75 Opaque
  • MSP75 neutral

SPEED version is also available to reduce drying time of 20%. Available in 250ml bottle and 5kg drum.