WAVE SOLDERING / SELECTIVE SOLDERING

MBO alloys :

Made from very high purity primary metals
Obtained by rigorously controlled processes, guaranteeing the absence of oxide
Composition validated by ICP-AES, compliant with ISO 9453 and J-STD 006 standards

See the table in the welding wire section for the most common alloys. Elements can be added to improve the properties of the alloy (e.g. G2 version).

Possible shapes (consult us for the dimensions required) :

bars
ingots
chopsticks
solid wire
pellets
domes

RoHS lead-free alloys :

Differents alloys are manufactured by MBO (SAC 305, SAC0307, Sn99Cu and Sn97Cu3)
« High-performance » Sn99CuNiGe and Sn99Cu SP lead-free and silver-free alloys

A NEW ALLOY CALLED SIA®

This lead-free alloy offers the same operating temperatures as Sn60Pb40 and Sn63Pb37 alloys, with the same advantages (very good wettability, excellent mechanical properties, etc.).
The characteristics of the joints obtained are better than those of lead-free SnCu and SnAgCu alloys.
Please do not hesitate to contact us for further information on this new product (which is available for waves and soldering paste applications).

	Alcohol Base	Low Residues No Clean Alcohol Base	Water-Soluble Residues Water Base

	Softwood	Softwood	Organics	Organics


J-STD-004 Ranking	ROL0	ROL1	ROM1	ROL0	ORL0	ORL0
MBO Flux Names	BC 250	BC 156 BC 310 BC 310.15 BC 310.35 FR 601 FR 719 CMS 2020	BC 340	BCX5M FXL 248	40S2 40S2A 40S2AM 40S2S 50S2A 50S2AMS LF 40 LF 50-SMT(S) EXEL 112 SO EXEL 314 EXEL 600 EXEL LF 7 FXL 880 PB	WBF02T WBF04T HYDREXEL 302 LF HYDREXEL 103 LF HYDREXEL 107 WATER-RISE 1 WATER-RISE 2 WATER-RISE 3
Benefits				- Alcohol base - Contains very little resin - Lead alloy and lead-free compatible	- Alcohol base - Absolutely halogen-free - Complies with the various tests as it contains no rosin or resin - Lead alloy and lead-free compatible	- Non-flammable, easy to transport - 100% water-based, no VOC emissions - Absolutely halogen-free - Wave and/or selective soldering - Complies with various tests as it contains no rosin or resin - Fluxer spray application (+ foam depending on formula) - No density control

Fluxes

The purpose of the flux is to facilitate the soldering process. One of the obstacles to a successful solder joint is impurity at the solder interface, for example dirt or oxidation. Impurities can be removed by mechanical or chemical cleaning, but the high temperatures required to melt the filler metal (the solder) can lead to re-oxidation. This effect is accelerated by the increase in brazing temperature and can, in some cases, prevent the soldering process from being completed. Some fluxes help to prevent oxidation and also provide a form of chemical cleaning (against corrosion).

For many years, and still today, the most common type of flux used in electronics (soldering) was based on rosin, a natural resin derived from selected pine trees. This resin is ideal because it is non-corrosive and non-conductive at normal temperatures (25°C to 65°C) but becomes slightly reactive (corrosive) at high soldering temperatures. Plumbing and automotive applications, among others, generally use a strong acid-based flux (e.g. hydrochloric acid) to clean the workpiece. These fluxes cannot be used in electronic equipment, as they are conductive and end up dissolving small-diameter wires. In this case, it is necessary to clean the solder residue. Many fluxes also act as a wetting agent in the soldering process by reducing the surface tension of the molten filler metal, allowing it to spread more evenly over the parts to be soldered.

WATER-RISE 2

This water-based flux is designed for wave soldering applications. Due to its composition, this flux is non-flammable and therefore easy to transport. The ORL0 classification of the flux guarantees the absence of corrosion over time. This flux is compatible with all lead and lead-free alloys, but is particularly recommended for SIA®.

For soldering, fluxes fall into 3 main families :

Water-soluble fluxes
These fluxes are highly active and require residues to be cleaned (with water) after soldering to prevent corrosion over time.

No-clean fluxes
These fluxes are sufficiently « soft » that they do not « require » residue removal due to their non-conductive and non-corrosive nature. These fluxes are called « no-clean » because the residue left after the soldering operation is non-conductive and will not cause an electrical short circuit; nevertheless, they leave a residue ranging from white to dark brown (depending on the soldering temperature) that is clearly visible.

Rosin-based fluxes
Traditional rosin-based fluxes are available in non-activated (R = Rosin), slightly activated (RMA = Rosin Midly Activated) and activated (RA = Rosin Activated) versions. RA and RMA formulations contain rosin combined with an activating agent, typically an acid, which increases wettability on the metals to which it is applied by removing existing oxides. The flux is formulated to give a residue that is generally non-corrosive, thereby providing optional cleaning of these residues.
The performance of a flux must be carefully evaluated : a very « soft », « no-clean » flux may be perfectly suitable for automatic production equipment but may not give satisfactory results for a poorly controlled manual soldering operation.

Complementary products

DESOXY SP and DESOXY SP PLUS deoxidising tablets to maintain bath stability (consult us for compatibility with different alloys).

Solution for « sparing » surfaces from brazing : Peel-off maskinge
Used when there is a need to temporarily and locally save surfaces that should not be brazed. Formula based on natural latex.