DIE ATTACH

Main advantages of MBO soldering paste :

Very good behaviour when dispensed
No Clean and halogen-free formulation
Extra-clear and colourless residues
Very low voids for long-term reliability of the weld joint

OP9 M Di no-clean soldering paste has been developed in MBO’s laboratories. It is specially designed to offer a high level of activity while leaving a very low residue, very clear and non-corrosive. This product, suitable for dispensing, meets the international requirements of the electronics industry.

ORL0 classification according to J-STD-004
Halogen-free
REACH compliant
High activity
Very low residue, neutral and colourless

OP9 M Di no-clean organic soldering paste is manufactured in strict compliance with current international standards.

Available alloys

	Composition
Alloy	Tin	Lead	Silver	Melting Point	Specific weight
Sn5Pb92.5Ag2.5	5% ± 0.2%	Rest	2.5% ± 0.1%	288°C - 296°C	11g/cm³
Other	On request : please contact us

Technical data

Alloy	Alloy Number ISO 9453 (2014)	Melting Point (°C)	Metal Content (%)	Viscosity (Step) Brookfield 20°C 5 rpm
Sn5Pb92.5Ag2.5	NA	296 - 301	84 - 85	190
Sn5Pb95	123	300 - 314	84 - 85	200
Other	On request : please contact us

Dispensing
OP9 M Di soldering paste is suitable for all dispensing machines with needles up to 0.41 mm in diameter (class 5 metal powder).

Packaging
5 cc, 10 cc and 30 cc syringes. Other on request.

Recommended conditions
18-22°C and 35% to 70% relative humidity.

Tool cleaning
Most standard cleaning products. Can also be used with hot water.

Storage
In original packaging, between 5 and 10°C, for up to 6 months. Wait until the syringes are at room temperature before using them to avoid condensation on the soldering paste. Storage at room temperature : 7 days maximum.

Additional information
Our manufacturing processes have been subjected to a FMEA analysis.

Reflow

Heating methods
Convection, infrared, vapour phase, hot plate, heating bar, laser and others (in air or in inert atmosphere).

Reflow profile
See the recommended profile below.

Cleaning solvents
Most cleaners. Hot water can also be used. Cleaning temperature : 35-60°C.

Main benefits of MBO solid wire :

High purity and oxide-free
No organic contamination on the surface of the wire (extrusion process developed and constantly improved by MBO engineers)
Wide range of diameters available (from 18 mils to 40 mils). Other diameters available on request
Wire with low voids (< 5%)
Fully compatible with automatic thread dispensers

GENERAL FEATURES

Electronic component reliability is crucial.
Thermal and mechanical fatigue are key parameters in the development of defects.
A perfect weld joint is very important to obtain the best thermal performance.
Good wetting and low voids help to create a highly reliable connection.
MBO supplies solid, flux-free solder wires specially optimised for high-performance components and « DIE ATTACH » applications.
They are manufactured using a controlled process to ensure optimum quality.

Physical features

Category	Standard	Results
Activity Level (Classification)	IPC J-STD-004	ORL0
Halogen Content	IPC J-STD-00	Halogen-free (By Titration)
Copper Mirror	IPC TM-650 (2.3.32) / J-STD-004	Pass (No Evidence of Corrosion)
Silver Chromate	IPC TM-650 (2.3.33)	Pass
SIR Test (Surface Insulation Resistance)	GR 78 Core Section 13 (13.1.3.2)	Pass
Visual Aspect of Residues	IPC HDBK-005	Clear
Viscosity	Brookfield Viscometer (20°C - 5 rpm)	190 Pa.s (Sn5Pb92.5Ag2.5)
Solder Ball Test	IPC TM-650 (2.4.43)	Pass
Solder Wetting Test	IPC TM-650 (2.4.45)	Pass

Packaging / Storage
Solid wire : On special spools dedicated to the « DIE ATTACH » application.
Diameter in mils (18 to 40) in various lengths.
Storage : In original packaging at room temperature for 6 months. Column 2

Safety
MSDS available on request. Please consult it before using the product.

Additional information
Analysis certificate available on request.

DIE ATTACH