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SP 350 SIA
The SP 350 SIA® no-clean solder paste is a high-performance solution specifically designed for screen printing in the electronics industry. Formulated with the innovative SIA® alloy, it delivers high activity levels while leaving minimal, clear, and non-corrosive residues. The SP 350 SIA® meets the stringent demands of the electronics industry, ensuring enhanced reliability, especially for fine pitch and ultra-fine pitch applications.
Key Features:
High activity for efficient soldering
Easy-to-use, no cleaning required
Minimal residues for a flawless finish
High-speed screen printing for fast application
Long shelf life and abandon time
Versatility for fine pitch and ultra-fine pitch
Compliant with J-STD-004 and REACH standards
Successfully tested to IPC standards for quality and reliability
The SP 350 SIA® ensures:
Exceptional performance and reliability
Compliance with international standards
High-quality solder joints for the electronics industry
SP 350 SIA® No-Clean Solder Paste
Advantages
The SP 350 SIA® solder paste is specially designed for screen printing and delivers high activity levels while leaving minimal, clear, and non-corrosive residues. Formulated with the innovative SIA® alloy, it meets the demands of the electronics industry and ensures enhanced reliability, particularly for fine pitch and ultra-fine pitch applications.
- High activity: Ensures optimal performance for an efficient soldering process.
- No-clean: Simplifies production by eliminating the cleaning step while still allowing optional cleaning with Zestron products if needed.
- Minimal residues: Leaves only neutral and transparent residues for a flawless finish.
- High-speed screen printing: Enables fast and effective application up to 80 mm/s, with optimal results between 30 and 60 mm/s.
- Long shelf life: Offers up to 8 hours of screen life.
- Application versatility: Suitable for fine pitch (400 µm) and ultra-fine pitch (<300 µm).
- Enhanced reliability: The SIA® alloy offers double the shock resistance of SAC 305 and at least 40% greater pull strength.
Advantages of the SIA® Alloy:
- Low melting temperature: Close to that of Sn/Pb, adhering to electronic component specifications.
- Improved performance: Superior wettability, enhanced solder quality, and better mechanical resistance to shock and elongation.
- Energy savings: Reduces energy consumption by 30% during implementation.
- Environmentally friendly: Recyclable and non-toxic alloy.
- Ease of use: Requires no nitrogen in production lines and simplifies repairs.
Compliance and Successful Testing
The SP 350 SIA® meets industry standards and has passed rigorous testing to ensure quality and reliability.
- J-STD-004 Standard, ROL0 classification
- REACH compliant
- Chlorine-free (titration)
- IPC testing results:
- No corrosion (Copper Mirror)
- Halogen-free (Silver Chromate)
- High surface insulation resistance (SIR Test)
Technical Specifications
- Alloy: SIA® (Melting range: 139–195 °C)
- Packaging: 250g, 500g jars; 500g, 1000g cartridges; other formats available upon request.
- Storage: Store between 5°C and 10°C for up to 12 months. Allow the jar to reach room temperature before opening. Once opened, avoid refrigeration if consumed within 5 days.
Recommended Applications
The SP 350 SIA® is ideal for a range of applications in the electronics industry that demand high reliability.
- High-reliability applications, especially for fine pitch and ultra-fine pitch.
- Screen printing processes.
Choose SP 350 SIA® for:
- High-quality, no-clean solder paste performance and reliability.
- The innovation and benefits of the SIA® alloy.
- Peace of mind with compliance to international standards.
- High-quality solder joints for the electronics industry.
Contact MBO for more information about SP 350 SIA® solder paste.
