Solder dipping

Solder dipping

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Dipping is an operation which consists in applying a layer of tin to a metal part. The coating is deposited by immersion of the part in a tin bath in fusion.

In the case of tinning of large pieces, tin is used in the form of anodes (see photos of different anodes below). In particular, the use of anodes is common in electrolytic tinning applications.

In industry, tinning is mainly used in the electric field and electronics to ensure protection against corrosion of the part (in particular for copper parts), to offer good electric conductivity and to improve the wettability of the part. 
MBO has of a wide range of alloys and fluxes adapted to the dipping process.
Current alloys (see table of solder wires). In addition we offer alloys with special additives suitable for use at higher temperatures. (HT version)

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