MÉTAUX BLANCS OUVRÉS
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SOLDER PASTE DISPENSING / JETPRINTING PROCESS

MBO offers its customers a wide range of soldering pastes for both manual and automatic dispensing applications. MBO also develops soldering pastes for specific applications such as jetting and jetprinting. These soldering pastes have been approved by all the major manufacturers of dispensing machines and heads, including MYCRONIC, VERMES, MUSASHI, etc.

No Clean Water-Soluble
Lead-Free Lead Water Cleanable Residues
ROL0
ROL0
ORL0
SP 300 Di
RSN 70 LF Di
SIRIUS 1 LF Di
ORION 410 Di
410
721
ORION 414 LF JP

RSN 70 Di
SIRIUS 1 Di
ORION 410 Di
410
721
ORION 414 JP
CASCADE 1
* = for a high-temperature alloy Pb92,5Sn5Ag2,5

Activated version (RA) on request with ROL1 classification, SIRIUS 1 MD dedicated to high-temperature alloy (ROL1 classification).

JP version dedicated to Jet Printing in class 6.

Jet Printing application : Type 6 in SAC 305 (Sn96.5Ag3Cu0.5) and Type 5 for low temperature and lead alloys.

Melting Point (°C)
Alloy Solid Liquid
Sn95.5Ag3.8Cu0.7 (SAC 387)
217
Eutectic
Sn96.5Ag3Cu0.5 (SAC 305)
217
220
Sn95Sb5
235
240
Sn96.5Ag3.5
221
Eutectic
Sn99Ag0.3Cu0.7 / Sn98.5Ag0.8Cu0.7
217
227 / 224
Sn97Cu3
227
310
Sn99CuSP
227
Eutectic
SIA®
139
189
Sn43Bi57
139
Eutectic
Sn42Bi57.6Ag0.4 / Sn42Bi57Ag1
139
Eutectic
Sn63Pb37
183
Eutectic
Sn62Pb36Ag2
179
Eutectic
Pb92.5Sn5Ag2.5
296
301
Sn18Pb32Bi50
98
Eutectic
Other on request
Lead-free alloy
Lead alloy
  • Low-residue no-clean pastes
  • Manual or automatic dispensing
  • Reflow under air or nitrogen
  • Different possible activations

Perfectly spherical, oxide-free powders.
Controlled particle size, ranging from class 3 (25-45 µm) to class 6 (5-15 µm).

Packaging :

  • 10 g to 100 g syringes
  • 500 g, 1 Kg cartridges
SOLDER PASTE DISPENSING / JETPRINTING PROCESS

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NO-CLEANING
SOLDERING PASTE ORION 414 JP
NO-CLEANING
SOLDERING PASTE ORION 414 LF JP
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