New lead free solder paste SP 250

New lead free solder paste SP 250

In order to follow the market expectations, especially in terms of voids, MBO has developed a new
lead-free soldering paste named SP 250. This solder paste allows a very strong reduction of voids
after reflow while keeping a very good wettability on all standard substrates. Its ease of use and its J-
STD 004 ROL0 classification allow it to be adapted in many applications. Do not hesitate to ask us for
a sample to test it by yourself…

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