RT 500 solder paste is the latest solder paste developed by MBO, particularly for lead-free alloys (SnCu, SAC, SnAg, etc.), and represents a major development in solder paste management. It is temperature-stable for 3 months, which means it can be used without the need for refrigerated storage.
It has all the advantages of the latest versions of solder paste i.e. a very good voids rate (less than 10% in a traditional reflow oven and less than 5% in a vacuum reflow oven) and great stability of the solder paste over time.
This soldering paste, which has an ROL0 classification in accordance with J-STD 004, offers excellent wetting performance on most substrates used in electronics.