The SP 300 solder paste is the latest solder paste developed by MBO, particularly for lead-free alloys (SnCu, SAC, SnAg, etc.), and represents a major development of the SP 250 solder paste. It incorporates all the advantages of the SP 250 solder paste in terms of voids results (less than 10% in a traditional reflow oven and less than 5% in a vacuum) and adds a high level of stability to the solder paste over time.
This soldering paste, which has an ROL0 classification in accordance with J-STD 004, offers excellent wetting performance on most substrates used in electronics.