No-clean soldering cream for Jet Printing ORION 414 G2 LF JP
Advantages
- High activity for effective soldering.
- Leaves minimal, non-corrosive residues for a clean finish.
- Chlorine-free and REACH compliant.
- Meets the requirements of the international electronics industry.
Compliance and Successful Testing
- ROL0 classification according to J-STD-004 standard.
- Successfully passed tests:
- Activity level (classification): IPC J-STD-004 ROL0
- Halogen content: IPC J-STD-004 Chlorine-free (titration)
- Copper mirror: IPC-TM-650 (2.3.32)/J-STD-004 No corrosion
- Silver chromate: IPC-TM-650 (2.3.33) No halogen
- Surface insulation resistance (SIR) test: GR 78 Core Section 13, 13.1.3.2 Pass, 1×10^12 ohms
- Electromigration resistance test: GR-78-Core Section 13.1.4 Pass, >1×10^10 ohms
- Residue visual appearance: IPC-HDBK-005 Clear
- Coalescence test: IPC J-STD-005 Pass
Technical Specifications
- Alloy particle size: Class 6 (5-15µm) or Class 5 (15-25µm)
- Viscosity: 220 Pa.s (Brookfield Viscometer 5 rpm at 20°C)
- Storage temperature: Between 5 and 10°C (up to 6 months in its original closed packaging)
- Maximum ambient temperature: 15 days (opened pot)
- Packaging: Automatic syringes 10cc (30g) (other upon request)
- Tool cleaning: Most standard products.
- Heating methods: Convection, infrared, vapor phase, hot plate, induction, laser, etc.
- Atmosphere: Normal or inert
Available Alloys
- Sn96.5Ag3Cu0.5
- Sn42Bi57.6Ag0.4
- Sn42Bi58
- Other: contact us
Recommended Applications
Choosing ORION 414 G2 LF JP means choosing:
- A reliable, high-performance no-clean soldering solution.
- A product compliant with international electronics industry standards.
Contact MBO for more information on ORION 414 G2 LF JP.
