MBO RZ Solder Wire
The no-clean MBO RZ solder wire is designed for optimal performance in soldering applications on zinc and various substrates such as copper, tinned copper, and nickel-gold. Developed in MBO laboratories, this wire ensures high-quality soldering while minimizing residues and spattering. It is compatible with both lead-free alloys and Sn60Pb40 alloy.
Advantages
- Good activation: Guarantees excellent wettability, particularly on zinc.
- Fast wetting: Optimizes soldering quality and speed.
- Non-corrosive residues: Reduces risks and minimizes the need for cleaning.
- Non-aggressive fumes: Ensures a safer working environment.
- Reduced spattering: Enables precise and clean work.
- Compatible with lead-free alloys: Complies with international standards.
Technical specifications
- Available alloys:
- Sn96.5Ag3Cu0.5 (Melting point: 217-220°C)
- Sn99Ag0.3Cu0.7 (217-227°C)
- Sn99.3Cu0.7 (227°C)
- Sn99CuSP (227°C)
- Sn99CuNiGe (227°C)
- Sn97Cu3 (227-310°C)
- Halogen content: None.
- Flux percentage: 3% standard (other options available on request).
- Acid value: 138 mgKOH/g.
- Classification: J-STD-004, ROL0.
- Application: Soldering on zinc.
Applications
The MBO RZ solder wire is ideal for:
- Soldering on zinc, particularly in capacitor manufacturing.
- Soldering on copper, tinned copper, and nickel-gold.
- Various soldering methods including soldering iron, hot air, induction, or hot plate.
Usage conditions
- Working temperature: Between 360°C and 450°C for standard applications.
- Residue cleaning: If needed, residues can be removed using common solvents such as alcohols or hydrocarbons.
- Storage: Store in original packaging at room temperature for up to 24 months.
Why choose the MBO RZ solder wire?
- Performance and reliability for demanding applications.
- Reduced cleaning requirements thanks to non-corrosive residues.
- Adaptability to a wide range of methods and substrates.
- Compliance with international standards for peace of mind.
Contact MBO for more information or specific requests.