MBO is certified ISO 9001 and IATF 16949
No-Clean Solder Paste AP 110
The AP 110 cream has been formulated to be compatible with lead alloys. This solder paste offers excellent wettability on all standard substrates and very good long-term stability. It is recommended for all screen printing applications using lead alloys, particularly in cases of fine or ultra-fine pitches. Its ROL0 classification according to the J-STD 004 standard provides an added advantage, as its residues after reflow will remain neutral over time…
Advantages
- High activity for a highly efficient soldering process.
- Leaves minimal, clear, and non-corrosive residues.
- Chlorine-free formula.
- High screen printing speed (up to 80 mm/s).
- Long abandonment time (8 hours).
- Extended on-screen lifetime (8 hours).
- Suitable for “fine pitch” (400µm) and “ultra-fine pitch” (<300µm).
Compliance and Successful Testing
- ROL0 classification according to J-STD-004 standard.
- Compliance with IPC-TM-650 standard (Copper Mirror, Silver Chromate).
- Successful Surface Insulation Resistance Test (SIR) and Electromigration Resistance Testing.
- Coalescence Test: Passed.
Technical Specifications
- Available in classes 3, 4, and 5.
- Packaging: 250g, 500g jars – 500g, 1000g cartridges – 800g Proflow® – others on request.
- Storage temperature: Between 5°C and 10°C for up to 12 months in original sealed packaging.
- Maximum ambient temperature: One week (open jar).
- Cleaning of tools and screens: Compatible with most standard products.
- Heating methods: Convection, infrared, vapor phase, hot plate, induction, laser, etc., under normal or inert atmosphere.
Available Alloys
- Sn62Pb36Ag2
- Sn63Pb37
- Others: Contact us
Recommended Applications
- “Pin in Paste” type applications.
- Screen printing.
Choosing AP 110 means choosing:
- An effective and reliable no-clean soldering solution, ideal for the electronics industry.
- A product compliant with international standards, ensuring high-quality solder joints.
