RSN 70 LF Di Soldering Cream

Advantages of RSN 70 LF Di SIA:

• Revolutionary SIA® Alloy: Offers a melting point close to Sn/Pb while outperforming common lead-free alloys.
• Reduced Melting Temperature: Identical to Sn/Pb for optimal component compatibility.
• Improved Wetting: Provides superior solder joints.
• Increased Shock and Elongation Resistance: Ensures long-term reliability.
• Reduced Power Consumption: Lowers energy use during implementation.
• Recyclable and Non-toxic.
• Eliminates the Need for Nitrogen: Reduces dross on production lines.
• Increased Productivity and Simplified Repair.
• High Activity: Ensures optimal performance for an efficient soldering process.
• No Cleaning: Simplifies production by eliminating the cleaning step.
• Minimal Residues: Leaves only low, neutral, and colorless residues for a flawless finish.
• Precise Application by Dispensing: Suitable for machines equipped with needles up to 0.41 mm in diameter.

Compliance and Passed Tests:

• J-STD-004 Standard, Classification ROL0.
• Chlorine-free (titration).
• REACH Compliant.
• Passed IPC Tests:
  • No Corrosion (Copper Mirror).
  • No Halogen (Silver Chromate).
  • High Surface Resistance (SIR Test).
  • Resistance to Electromigration.
  • Good Coalescence.
  • Excellent Wetting (SIA® Test).

Technical Specifications:

• Alloy Available: SIA® (Melting point: 139-195°C, DSC measurement).
• Packaging: Syringes of 5cc, 10cc, 30cc. Other sizes available upon request.
• Storage: Store between 5°C and 10°C for up to 6 months. Can be stored at room temperature for a maximum of 15 days after opening.

Recommended Applications:

• Electronics industry.
• Applications requiring high reliability.
• Heat-sensitive components.

Choosing RSN 70 LF Di SIA means choosing:

• The superior performance and reliability of the SIA® alloy.
• A simplified production process with no cleaning.
• Peace of mind through compliance with international standards.
• High-quality solder joints for the electronics industry.