Soldering Paste SP 300 Di

SP 300 Di Soldering Paste – No-Clean “LEAD-FREE”

Benefits

• High activity for optimal performance.
• Minimal, neutral, and colorless residues for a clean and aesthetic finish.
• Chlorine-free for safer and more environmentally friendly use.
• REACH compliant to meet European regulatory requirements.
• Suitable for dispensing application for precise and efficient use.

Compliance and Testing

The SP 300 Di soldering paste has undergone rigorous testing to ensure quality and reliability. It complies with international standards for the electronics industry and has passed the following tests:

• Activity Level: ROL0 per IPC J-STD-004 standard.
• Halide Content: Chlorine-free (titration) per IPC J-STD-004.
• Copper Mirror: No corrosion per IPC-TM-650 (2.3.32) and J-STD-004 standards.
• Silver Chromate: Halogen-free per IPC-TM-650 (2.3.33).
• Surface Insulation Resistance (SIR): Adequate, 1×10^12 ohms per GR 78 Core Section 13, 13.1.3.2 standard.
• Electromigration Resistance: Adequate, >1×10^10 ohms per GR-78-Core Section 13.1.4.
• Visual Residue Appearance: Clear per IPC-HDBK-005.
• Viscosity: 210 Pa.s (SAC 305-3) measured with Malcom viscometer (J-STD-005).
• Coalescence Test: Adequate per IPC J-STD-005.

Technical Specifications

Available Alloys

The SP 300 Di soldering paste is available in a range of alloys to meet your specific needs.

Alloy Chart:

• Dispensing: Suitable for dispensing machines equipped with needles down to 0.41 mm diameter (Class 5 metal powder).
• Packaging: Available in 5 cc, 10 cc, and 30 cc syringes. Other packaging options available upon request.

Ambient Conditions

• 18-22°C and 35%-70% relative humidity.
• Limit direct exposure to air currents.

Tool Cleaning Compatible with most standard cleaning products.

Reflow

• Heating methods: convection, infrared, vapor phase, hot plate, induction, laser, etc., under normal or inerted atmosphere.

Storage

• Store in original packaging between 5 and 10°C for up to 6 months.
• Allow syringes to reach room temperature before use to avoid condensation.
• At room temperature: maximum 15 days.

Recommended Applications

The SP 300 Di soldering paste is ideal for a variety of applications in the electronics industry, including:

• Electronic board assembly
• Soldering of electronic components
• PCB repair and rework

Choosing SP 300 Di means choosing:

• The quality and reliability of a product developed and tested by MBO laboratories.
• The performance of a high-activity soldering paste.
• The cleanliness of a product with minimal, neutral, and colorless residues.
• The safety of a chlorine-free and REACH-compliant solder paste.
• The versatility of a product suitable for multiple applications.

Contact MBO for more information about the SP 300 Di soldering paste.