MBO is certified ISO 9001 and IATF 16949
Ultrasonic Solder Alloy Sn US
MBO now offers a wire designed for ultrasonic soldering. This wire, with its patented composition, is intended to eventually replace traditional soldering solutions for materials with very low solderability (e.g., aluminum, ceramics, alumina, etc.). The advantages are numerous, and one of the most important is the absence of flux required for soldering. As a result, no organic or inorganic impurities remain after soldering. Environmental aspects and working conditions are drastically improved. The melting point, around 245°C, allows this new product to be used in various applications.
Sn US Solder Alloy
Advantages of the Sn US Solder Alloy:
- Flux-free soldering: An environmentally friendly process, without the addition of acids or aggressive fluxes.
- Non-solderable substrates: Perfect for aluminum, ceramics, glass, and other difficult materials.
- No corrosion: Reduces the risk of corrosion for durable solder joints.
- Simplified use: No need for fume extraction systems, improving working conditions.
- Ultrasonic cavitation process: Cleans and removes surface oxides without chemicals.
Technical Characteristics:
- Melting point: 240-245°C
- Composition: Mainly tin with 0-10% antimony and additional elements for ultrasonic activation
- Form: Solid wire available in diameters of 1 mm and 1.5 mm; other sizes available upon request
- Packaging: Spools of 250 g or 500 g
- Storage: Up to 24 months in original packaging, at room temperature
Recommended Applications:
- Soldering non-solderable substrates like aluminum, glass, and ceramics
- Industrial applications requiring a clean soldering process without flux
- Uses sensitive to electromigration
Choosing the Sn US solder alloy means choosing:
- An innovative and environmentally friendly soldering solution.
- Compatibility with difficult substrates without aggressive fluxes.
- Durable, corrosion-free solder joints for modern industries.
