OP9 M Di Soldering Cream

Benefits:

• High Activity: Enables efficient and reliable soldering.
• Low Residue: Leaves minimal, clear, and non-corrosive residues after the soldering process.
• Chlorine-Free: Meets strict environmental standards.
• REACH Compliant: Adheres to European chemical regulations.
• Dispensing Compatibility: Designed for precise and effective dispensing application.

Compliance and Successful Testing:
The OP9M Di solder paste has undergone rigorous testing to meet industry standards. Key test results include:

• Activity Level: Classified as ORL0 according to IPC J-STD-004.
• Halogen Content: Chlorine-free, confirmed through titration (IPC J-STD-004).
• Corrosion: No signs of copper corrosion (IPC-TM-650 (2.3.32) / J-STD-004).
• Surface Insulation Resistance (SIR): Meets the requirements of the GR 78 Core Section 13, 13.1.3.2 test.
• Residue Appearance: Clear residues ensure a clean look post-soldering (IPC-HDBK-005).

Technical Specifications:

• Type: Organic no-clean solder paste.
• Available Alloy: Sn5Pb92.5Ag2.5 (other alloys available upon request).
• Viscosity: 190 Pa.s (measured at 20°C, 5 rpm).
• Packaging: 5 cc, 10 cc, 30 cc, and 50 cc syringes (custom packaging available upon request).

Recommended Applications:

• Electronics Industry: Ideal for applications requiring high activity and low residue.
• Assembly of Sensitive Electronic Components: Ensures reliable and clean soldering.
• Precision Dispensing Applications: Designed for accuracy and control.

Choose OP9M Di for:

• A reliable and high-quality soldering solution.
• Compliance with strict environmental standards.
• Precise and controlled application.

Contact MBO for more information about OP9M Di.