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Peelable Mask MSP/75 OPAQUE
The MSP/75 OPAQUE is a masking product used to protect areas of printed circuit boards that should not be soldered. It is applied in a thin layer and then allowed to cure at room temperature for about 60 minutes. Once cured, MSP/75 OPAQUE can withstand temperatures up to 300°C for a maximum of 5 seconds. After the printed circuit board cools, the mask is easily removed. This product stands out for its opacity after curing, allowing better visibility of the protected areas. It is available in 250 ml bottles or 3.5-liter containers.
Peelable Mask MSP/75 OPAQUE
Benefits:
- Reliable solder protection: MSP/75 OPAQUE forms a solder-resistant barrier, effectively protecting critical areas of your printed circuit boards.
- Enhanced visibility: Its opaque white color after curing allows better localization of masked areas, reducing visual strain and potential errors.
- High-temperature resistance: Withstands high temperatures up to 300°C for short periods, making it suitable for common soldering processes.
- Ease of application: Applies easily in a thin, uniform layer, allowing for precise masking of desired areas.
- Clean removal: Easily peels off cleanly after soldering, without leaving any unwanted residue.
Compliance and successful tests:
The document does not mention specific successful compliance tests. It is indicated that users should perform their own tests to determine the product’s suitability for their specific application.
Technical features:
- Color: White
- Solid content: 55 – 60%
- Viscosity: 46.5 – 51 Pa.s
- pH: 9 – 11
- Solubility: Soluble in water before curing
- Curing time: Approximately 60 minutes at room temperature (may vary depending on thickness)
- Packaging: 250 ml bottles and 3.5-liter containers
- Shelf life: 12 months
- Optimal storage temperature: 10°C to 30°C
Recommended applications:
- Masking of electronic components: Ideal for protecting sensitive components, connectors, vias, and traces during wave or hand soldering.
- Protection of specific areas: Allows precise masking of areas that should not be soldered on printed circuit boards, such as gold contacts, test zones, and bonding points.
- Industrial applications: Suitable for mass production applications thanks to its ease of application and good visibility.
Choosing MSP/75 OPAQUE means choosing:
- Reliable and effective solder protection during soldering.
- A precise and visible masking process, reducing errors.
- An easy-to-use and remove product, leaving a clean surface.
Contact MBO for more information about the MSP/75 OPAQUE peelable mask.
