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RT 500 No-Clean Soldering Cream
The RT 500 solder paste is the latest solder paste developed by MBO, particularly for lead-free alloys (SnCu, SAC, SnAg, etc.) and represents a major development in solder paste management. It is indeed temperature stable for 6 months, which allows its use without the need for refrigerated storage.
RT 500 solder paste is the latest solder paste developed by MBO, specifically designed for lead-free alloys (SnCu, SAC, SnAg…) and represents a major advancement in solder paste management. It is temperature stable for up to 6 months, allowing its use without requiring refrigerated storage.
It incorporates all the advantages of the latest versions of solder pastes, including a very low void rate (less than 10% in a conventional reflow oven and less than 5% under vacuum) and ensures great solder paste stability over time.
This solder paste, classified as ROL0 according to the J-STD 004 standard, offers significant wettability performance on most substrates used in electronics.
Advantages
– High activity, leaving low, clear, and non-corrosive residues.
– Suitable for fine-pitch (400μm) and ultra-fine pitch (<200μm) screen printing applications.
– Available in a variety of alloys to meet different needs.
– Long screen life (8 hours).
– Long abandon time (8 hours).
– REACH and RoHS compliant.
Compliance and Successful Testing
– Classified as ROL0 according to the J-STD-004 standard.
– Chlorine-free.
– Passed the following tests:
– Copper mirror test (IPC-TM-650 (2.3.32) /J-STD-004)
– Silver chromate test (IPC-TM-650 (2.3.33))
– Surface insulation resistance (SIR) test (GR 78 Core Section 13, 13.1.3.2)
– Electromigration resistance test (GR-78-Core Section 13.1.4)
– Coalescence test (IPC J-STD-005)
– Cold/Hot Slump test (type 4) (IPC TM 650 2.4.35)
– Solder ball test (IPC TM 650 2.4.43)
– Wettability test (IPC TM 650 2.4.45)
– Bridging test
Technical Characteristics
– Viscosity: 160 Pa.s (Malcom Viscometer (J-STD-005) SAC 305-4); variable depending on the alloy.
– Residue visual appearance: Clear
– Storage temperature: Between 5 and 10°C (in its original packaging)
– Shelf life: 12 months (in original packaging, between 5 and 10°C); 6 months at room temperature (closed container).
– Packaging: 250g, 500g jars – 500g and 1000g cartridges – others on request
Recommended Applications
– Electronics industry
– “Pin in Paste” applications
Choosing RT 500 means choosing:
– A solder paste stable at room temperature.
– A high-performance, reliable solder paste.
– A solution compliant with international standards.
– A user-friendly product.
