SP 350 SIA® Soldering Paste
The SP 350 soldering paste is designed to leverage the unique properties of the SIA® alloy, particularly to limit solder ball formation during reflow. This paste enables the formation of a solder joint at lower temperatures than SnAg, SnCu, and SnAgCu alloys while maintaining good mechanical properties. Its ROL0 classification according to J-STD 004 standards also makes it a versatile solution for various applications.
SP 350 SIA® Soldering Paste
Benefits
- Reduced Melting Temperature: Similar to Sn/Pb, meets electronic component specifications and enhances long-term reliability.
- High Performance: Provides high activity levels with minimal, clear, non-corrosive residues.
- Adaptability: Suitable for screen printing and “fine pitch” (400µm) as well as “ultra-fine pitch” (<300µm) applications.
- Increased Reliability: Improved mechanical shock and elongation resistance compared to SAC305 and SnCu alloys.
- Enhanced Productivity: Reduced energy consumption by 30% during use, reduced dross, and easier repair.
- Environmentally Friendly: Recyclable, non-toxic alloy.
Conformance and Successful Testing
- ROL0 Classification according to J-STD-004
- Chlorine-free
- REACH Compliant
- Passed Compliance Tests: Copper Mirror, Silver Chromate, Surface Insulation Resistance (SIR), Electromigration Resistance, Solder Ball Test, Wetting Test, Cold/Hot Slump.
- Reliability Testing Success: Shock resistance (twice as high as SAC 305), peel strength (40% better than SAC 305), Intermetallic Compound (IMC) analysis.
Technical Specifications
- Available Alloy: SIA® NA
- Melting Point: 139-195°C (DSC measurement)
- Viscosity: 160 Pas (Malcom 10 rpm)
- Alloy Density: 7.9
- Packaging: 250g, 500g jars; 500g, 1000g cartridges; 800g Proflow®; others upon request.
- Storage: 5 to 10°C for up to 12 months in original sealed packaging.
Recommended Applications
- Electronics Industry
- Screen Printing
- “Fine pitch” and “ultra-fine pitch” applications
Choosing SP 350 SIA® means choosing:
- A reliable, high-performance soldering solution.
- A product compliant with international standards.
- An environmentally friendly alloy.
Contact MBO for more information on the SP 350 SIA® Soldering Paste.