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SP 300 Soldering Cream

The SP 300 no-clean solder paste is a high-performance solution for screen printing in the electronics industry. It is designed to provide high activity while leaving minimal, clear, and non-corrosive residues. The SP 300 is ideal for applications requiring high reliability and high-quality solder joints.

Key Features:

High activity for efficient soldering
Easy-to-use, no cleaning required
Minimal residues for a flawless finish
High-speed screen printing for fast application
Long shelf life and abandon time
Versatility for fine pitch and ultra-fine pitch
Compliant with J-STD-004 and REACH standards
Successfully tested to IPC standards for quality and reliability
The SP 300 guarantees:

Exceptional performance and reliability
Compliance with international standards
High-quality solder joints for the electronics industry

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SP 300 No-Clean Solder Paste

Advantages

The SP 300 solder paste is specifically designed for screen printing, offering high activity while leaving minimal, clear, non-corrosive residues.

  • High activity: Ensures optimal performance for an effective soldering process.
  • No cleaning: Simplifies production by eliminating the cleaning step.
  • Minimal residues: Leaves only low, neutral, and transparent residues for a flawless finish.
  • High-speed screen printing: Enables fast and efficient application up to 100 mm/s, with optimal results between 40 and 80 mm/s.
  • Long shelf life: Offers long abandonment time (8 hours) and extended life on screen (8 hours).
  • Versatility: Suitable for fine pitch (400µm) and ultra-fine pitch (<300µm).

Compliance and Successful Testing

The SP 300 complies with industry standards and has passed rigorous testing to ensure its quality and reliability.

  • J-STD-004 standard, ROL0 classification.
  • REACH compliance.
  • Chlorine-free (titration).
  • IPC successful tests:
    • No corrosion (Copper Mirror).
    • No halogens (Silver Chromate).
    • High surface resistance (SIR Test).
    • Electromigration resistance.
    • Good coalescence.

Technical Specifications

  • Available alloys:
    • Sn96.5Ag3.5 (Melting point: 221°C)
    • Sn96.5Ag3Cu0.5 (Melting point: 217/220°C)
    • Sn95.5Ag3.8Cu0.7 (Melting point: 217°C)
    • Sn99Ag0.3Cu0.7 (Melting point: 217/227°C)
    • Sn99CuSP (Melting point: 227°C)
    • Other alloys available upon request.
  • Packaging: 250g, 500g jars; 500g and 1000g cartridges; other sizes available on request.
  • Storage: Store between 5°C and 10°C for up to 12 months. Let the jar reach room temperature before opening. Once opened, do not refrigerate if the jar is to be used within 3 days.

Recommended Applications

The SP 300 is ideal for a variety of applications in the electronics industry.

  • Electronics industry.
  • Applications requiring high reliability.
  • Screen printing processes.
  • Pin-in-paste applications.

Choosing SP 300 means choosing:

  • The performance and reliability of a high-quality no-clean solder paste.
  • Peace of mind with compliance to international standards.
  • High-quality solder joints for the electronics industry.

Contact MBO for more information about SP 300 solder paste.

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    Izabela Krawczyk

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