SOLDER PASTE PRINTING

No Clean	Water-Soluble

Lead-Free	Lead	Water-Cleanable Residues
ROL0	ROL0	ORL0
SP 300 SP 350 RSN 70 LF SIRIUS 1 LF ORION 410 410	AP 110 RSN 70 SIRIUS 1 ORION 410 410 TITANT HT 12*	CASCADE 1LF-C

* = for a high-temperature alloy Pb92,5Sn5Ag2,5

Activated version (RA) on request in ROL1 classification.

SP 300 lead-free soldering paste reduces the formation of voids during reflow.
Results of less than 10% voids can be achieved with standard reflow ovens.
With vacuum reflow processes, results of less than 5% are possible. Its J-STD 004 ROL0 classification and its excellent wetting properties on conventional substrates mean it can a wide range of applications.

AP 110 paste has been formulated to be compatible with lead alloys. This soldering paste offers excellent wetting properties on all conventional substrates and very good stability over time. It is recommended for all solder paste printing applications using lead alloys and for fine or ultra-fine pitch applications. Its ROL0 classification according to J-STD 004 adds a further benefit, as its residues after reflow will be neutral over time…

SP 350 soldering paste has been designed to take advantage of the characteristics of the SIA® alloy, and in particular to limit the formation of microbeads during reflow. This soldering paste enables a solder joint to be obtained at temperatures lower than those of SnAg, SnCu and SnAgCu alloys, while retaining good mechanical properties. Here again, its ROL0 classification under J-STD 004 makes it a versatile solution for many applications.

RSN 70 LF : soldering paste replacing the SIRIUS 1 LF version. Better stability over time (no drying phenomenon), better results in terms of solder paste printing and definition (no problems with 0.3 mm pitch). Solder paste printing speeds can be high (80 mm/s possible). This soldering paste is particularly recommended for use with lead-free alloys.
RSN 70 LF has an ROL0 rating and can be used in all applications where a No Clean paste is recommended.

	Melting Point (°C)

Alloy	Solid	Liquid
Sn95.5Ag3.8Cu0.7 (SAC 387)	217	Eutectic
Sn96.5Ag3Cu0.5 (SAC 305)	217	220
Sn99Ag0.3Cu0.7 (SAC 0307)	217	227
Sn96.5Ag3.5	221	Eutectic
Sn98.5Ag0.8Cu0.7	217	224
Sn97Cu3	227	310
Sn99CuSP	227	Eutectic
SIA®	139	189
Sn43Bi57	139	Eutectic
Sn42Bi57.6Ag0.4 / Sn42Bi57Ag1	139	Eutectic
Sn63Pb37	183	Eutectic
Sn62Pb36Ag2	179	Eutectic
Pb92.5Sn5Ag2.5	296	301
Sn18Pb32Bi50	98	Eutectic
Other on request

Lead-free alloy

Lead alloy

Low-residue no-clean pastes
High solder paste printing speed
Long life on screen
Reflow under air or nitrogen
Different possible activations
Perfectly spherical, oxide-free powders
Controlled particle size, from class 3 (25-45 µm) to class 5 (15-25 µm)

Other particle sizes on request.

Complies with various IPC tests (SIR, Slump test, Tack force, Copper Mirror, Ball test, etc.).

Packaging :

250 g, 500 g jar
500 g and 1 Kg cartridges
Proflow cartridges

SOLDERING AND TOUCHING UP COMPONENTS WITH SOLDER GEL

Specially adapted for soldering BGAs, MOB 39 soldering gel is also used for soldering and touching up SMDs.
Totally no-clean and halogen-free (ROL0 classification according to J-STD-004), residues are non-corrosive and can remain on electronic boards without affecting insulation resistance.
Adhesive fluxes also available : FLT 396 - ABOHE.
Packaged in 5g and 10g manual/automatic syringes and 200g, 400g and 1Kg tubs.