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MBO has consolidated its range of solder wires and now offers wires with RES0 incorporated flux. This flux limits odours during soldering, limits spattering, offers a J-STD 004 ROL0 classification, ensures high soldering performance and leaves clear residues after soldering. This solder wire has excellent electromigration performance and passes the BONO test. Don’t hesitate to […]

The SP 300 solder paste is the latest solder paste developed by MBO, particularly for lead-free alloys (SnCu, SAC, SnAg, etc.), and represents a major development of the SP 250 solder paste. It incorporates all the advantages of the SP 250 solder paste in terms of voids results (less than 10% in a traditional reflow