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RT 500 solder paste is the latest solder paste developed by MBO, particularly for lead-free alloys (SnCu, SAC, SnAg, etc.), and represents a major development in solder paste management. It is temperature-stable for 6 months, which means it can be used without the need for refrigerated storage. It has all the advantages of the latest […]

MBO now offers a wire for ultrasonic soldering. This wire, whose composition is patented, is intended to eventually replace conventional soldering solutions for materials with very poor solderability (e.g. aluminium, ceramics, alumina, etc.). The advantages are numerous, and one of the most important is the absence of flux in the soldering process. This means that

MBO has added a new alloy to its range, SIA®. This alloy offers the same operating temperatures as Sn60Pb40 and Sn63Pb37 alloys, with the same advantages (very good wettability, excellent mechanical properties, etc.). The characteristics of the joints obtained are better than those of lead-free alloys SnCu and SnAgCu. Please do not hesitate to contact

MBO completes its range of soldering pastes with ORION 414 JP. This soldering paste dedicated to JET PRINTING (JETTING) offers very good performance in micro-spot application. Residues after soldering are very easy to clean.

MBO has just developed a new flux (ROB flux) which, when incorporated into solder wires, meets the requirements of automatic soldering applications (very good wetting, fast soldering, transparent residues even at high temperatures). J-STD 004 flux is classified as ROL1, which means it can be used in most applications, even manual soldering.

MBO presents its new RZ flux-cored wire, developed for use in capacitors. This resin-based solder wire offers excellent wetting performance on zinc. Its ROL0 classification (halogen-free) and its No Clean character also give it advantages, as soldering performance is equivalent to INH1=HC3 classifications (much more activated). Please do not hesitate to contact us for further

SP 250 lead-free solder paste limits the formation of voids during reflow. Results of less than 10% voiding can be achieved with standard reflow ovens. With vacuum reflow processes, results of less than 5% are possible. Its J-STD 004 ROL0 classification and its excellent wetting properties on conventional substrates mean it can be used for

This soldering paste is dedicated to tin/bismuth alloys and offers very good results in terms of wettability. This soldering paste is particularly recommended for use with the SIA® alloy. During reflow, the formation of microbeads is drastically reduced.

MBO has consolidated its range of solder wires and now offers wires with RES0 incorporated flux. This flux limits odours during soldering, limits spattering, offers a J-STD 004 ROL0 classification, ensures high soldering performance and leaves clear residues after soldering. This solder wire has excellent electromigration performance and passes the BONO test. Don’t hesitate to

The SP 300 solder paste is the latest solder paste developed by MBO, particularly for lead-free alloys (SnCu, SAC, SnAg, etc.), and represents a major development of the SP 250 solder paste. It incorporates all the advantages of the SP 250 solder paste in terms of voids results (less than 10% in a traditional reflow