AP 110 Di no-clean soldering cream

AP 110 Di soldering cream

Advantages of the AP 110 Di soldering cream:

• Advanced formulation: High activity level, specially designed for dispensing.
• Minimal residues: Leaves only low, neutral, and colorless residues for a clean finish.
• No cleaning required: Simplifies the production process by eliminating the cleaning step.
• Compliance with standards: ROL0 classification according to J-STD-004.
• Chlorine-free: Meets REACH safety requirements.
• Electromigration resistance and high surface insulation: Ensures optimal long-term reliability.
• Compatibility for dispensing: Suitable for machines equipped with needles up to 0.41mm in diameter.

Compliance and Successful Tests:

• J-STD-004 standard, ROL0 classification.
• Chlorine-free (titration).
• Complies with REACH.
• IPC tests passed:
  • No corrosion (Copper Mirror).
  • No halogen (Silver Chromate).
  • High surface resistance (SIR Test).
  • Electromigration resistance.
  • Good coalescence.
  • Neutral and clear residues (IPC-HDBK-005 Test).

Technical Features:

• Available alloys: Sn62Pb36Ag2 (Melting point: 171°C), Sn63Pb37 (Melting point: 183°C).
• Packaging: Syringes of 5cc, 10cc, 30cc. Other formats upon request.
• Storage: Store between 5°C and 10°C for up to 6 months. Store at room temperature for a maximum of 15 days after opening.

Recommended Applications:

• Electronics industry.
• Applications requiring high reliability.
• Heat-sensitive components.

Choosing the AP 110 Di soldering cream means:

• A high activity level and minimal residues for efficient production.
• A no-clean process, simplifying manufacturing.
• Compliance with international standards for guaranteed solder quality in the electronics industry.